HAYWARD, CA — Gel-Pak, a Delphon company and a worldwide leader in cutting-edge materials and protective carriers for photonic devices, today announced it will demonstrate its latest material breakthroughs for the photonics market at Photonics West. The products exemplify the company’s 40-year track record of collaborative development and innovation in photonics component handling solutions. 

Working in collaboration with key industry leaders, Gel-Pak designed novel elastomer materials and form factors to streamline process steps in the manufacturing of photonic components. These advances allow for faster throughput and significantly reduced risk of breakage of high-value devices. 

• The Gel-Pak TXF film carrier uses a unique micro texture to secure and protect fragile photonic devices using non-adhesive holding forces. The product offers a clean method of holding optical components by only touching two percent of a device’s surface, which significantly reduces residue.
• The company’s latest VMF carrier is currently in development with a large optics supplier. It minimizes contact to the active area of an optic’s surface. Because contact is limited to the non-critical sections of the optical device, costly cleaning steps can be avoided. 

 “Photonics industry standards are more advanced and stringent than ever before, which is driving the need for cleaner and more protective handling and transport,” said Joe Montano, Delphon CEO. “The industry is quickly converging on zero tolerance for residue and contamination that interfere with device performance. Our collaborative approach to product development allows us to stay one step ahead of emerging market demands and drives continuous product innovation to ensure your photonic devices remain free from damage during handling and transport.”