Goldilocks Principle Wrong for Particle Assembly

Too hot and too cold is just right.

Written byNew York University
| 2 min read
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Microscopic particles that bind under low temperatures will melt as temperatures rise to moderate levels, but re-connect under hotter conditions, a team of New York University scientists has found. Their discovery points to new ways to create “smart materials,” cutting-edge materials that adapt to their environment by taking new forms, and to sharpen the detail of 3D printing.

“These findings show the potential to engineer the properties of materials using not only temperature, but also by employing a range of methods to manipulate the smallest of particles,” explains Lang Feng, the study’s lead author and an NYU doctoral student at the time it was conducted.

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