Research Partnership Fosters International Internship Program

A decade-long research partnership between Professor of Mechanical Engineering S.B. Park and his research group and Samsung Techwin has taken another step to expand academic opportunities for Binghamton University students at the international level.

Written byBinghamton University
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A decade-long research partnership between Professor of Mechanical Engineering S.B. Park and his research group and Samsung Techwin has taken another step to expand academic opportunities for Binghamton University students at the international level.

“I connected with Samsung through technical conferences and after that many of their high-profile executives came here several times for research collaborations,” Park said. Samsung became a member of the Integrated Electronics Engineering Center (IEEC), now part of the Center of Excellence in Small Scale Systems Integration and Packaging (S3IP). “They wanted to perform some research, mostly mobile device development, especially for surface mount and assembly technology and reliability engineering,” said Park. “We’ve been working closely with them on product-related technology development ever since.”

The collaboration has fostered a growing relationship with the University. Watson School Dean Krishnaswami “Hari” Srihari and Vice President for Research Bahgat Sammakia have made visits to Korea to strengthen research collaborations, but discussions of an academic partnership began in earnest last November.

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