scanning transmission electron microscope
AMBER X 2 delivers advancements in plasma FIB technology to further close the performance gap between Ga FIB and plasma FIB
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Study reveals interactions that could be used to enhance the mechanical performance of high- and medium-entropy alloys
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Originally for the 300kV cryo-TEM, the low-energy-spread cold FEG is now available for the 200kV as well
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Researchers bring nonlinear optical phenomena to electron microscopy
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The physical structure and composition impacts quality and safety
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Built from the ground up for multimodal nano-characterization
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All-in-one (S)TEM enables the understanding of complex samples for materials scientists and semiconductor manufacturers
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Generates repeatable, high-quality semiconductor analysis to accelerate device development and maximize yields
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